HICHIP-Manufacturing Process

Manufacturing Process

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HICHIP has accumulated certain resource advantages and processing experience, and has integrated strategic partners such as core technology designers, packaging and testing manufacturers. Product lines include USB, SSD, etc. Support high-stack packaging, high packaging and testing yield, and moderate cost.

High Performance

High security

Flexible expansion

USB

SSD

Manufacturing Process ■

Inked Wafer
Inked die Transfer
Die Sorting
Packaging
Flash IC F/W
P/N Marking
SMT
Flash Card Tester
Module

Inked Wafer
Inked die Transfer
Die Sorting
Packaging
Flash IC F/W
P/N Marking
SMT
Flash Card Tester
Module

Measured Data ■

128GB SSD

256GB SSD

HICHIP Corp.

Mail: info@hichipcorp.com

HK Address：ROOM A 3/F WING TAT COMMERCIAL BUILDING 121-125 WING LOK STREET SHEUNG WAN HK

Beijing Address ：No. 3020, Area D, 3rd Floor, Xueyuanyuan, Zhongguancun Dongsheng Science and Technology Park, No. 18, Xueqing Road Middle, Haidian District, Beijing

Products

Manufacturing Process
Flash
SSD Controller
AI-Infra Products

Solutions

Enterprise SSD
AI Computing
Autonomous and Controllable

Partners

DERA
SAMSUNG
SKhynix

About

About Team
Company Advantage

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